Contact Plating:
Core Architecture:
Core Processor:
DAC Channels:
Direction:
Factory Lead Time:
Family:
fmax-Min:
Height Seated (Max):
JESD-609 Code:
Memory Type:
Moisture Sensitivity Level (MSL):
Number of Bits per Element:
Number of Elements:
Number of Functions:
Number of I/O:
Number of Pins:
Number of Terminations:
Packing Method:
Pbfree Code:
Peak Reflow Temperature (Cel):
Pin Count:
Power Supplies:
Power Supply Current-Max (ICC):
Program Memory Type:
Propagation Delay:
Published:
Quiescent Current:
RAM Size:
Supply Current-Max:
Supply Voltage:
Supply Voltage-Max (Vsup):
Supply Voltage-Min (Vsup):
Surface Mount:
Terminal Pitch:
Thickness:
Time@Peak Reflow Temperature-Max (s):
Turn On Delay Time:
RFQ
BOM